RUMORED BUZZ ON ZIRCONIUM BROMIDE SILICON CARBIDE MELTING POINT

—Capacitive Micromachined Ultrasonic Transducers (CMUTs) are commonly fabricated either by common sacrificial launch process or by wafer bonding technique. During the former, sacrificial levels are patterned with deposited components over the substrate. This current work reviews a development over the aforementioned technique wherein sacrificial